Product Description
Sparse Pin Fin Heatsink
Designed for low airspeed environments and natural convection cooling (0-200 LFM)
A widely spaced pin design allows for efficient cooling in low airspeed environments
Overview
Sparsely configured pin fin heat sinks generate substantial cooling power in limited airspeed environments
The sparse pin fin configuration allows weak incoming air streams to efficiently enter and exit the pin array, thus providing efficient cooling in low airspeed environments
Sparsely configured pin fin heat sinks are highly suitable for heavily populated boards in which low pressure drop is an asset
Googe is committed to the provision of custom parts in a cost effective fashion, generally without any tooling or setup charges for footprint less than 70mmx70mm. Customizable parameters include length, width and height
Googe heat sinks are lapped in order to reduce the contact resistance between the heat sink and the device
Sparsely configured pin fin heat sinks range from a footprint of 15mm x 15mm to a footprint of 200mmx200mm and from a height of 5mm to a height of 40mm
Shanghai Googe Metal Products Co., Ltd. Is integrated with R&D, producing & marketing of thermal cooling product in East China Area. It's only half an hour driving from Shanghai Hongqiao international airport to Googe Company.
The products are being applicated in Cooling system of Power supply, IT, LED lighting and related industry field. We have our owner plant on Aluminum Extrusion, Aluminum forging, Copper forging and CNC&lathe machining.
